Benefits and Risks of High Aspect Ratio vias in ATE boards

Abstract:

This presentation explains the benefits and risks of high-aspect-ratio though-hole vias in high-density and fine-pitch printed circuit boards used in the test interface. Users are facing challenges as I/O counts increase, circuitry requirements have added to ATE PCB density, and array packages shrink below 0.65 mm pitch.

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Contact Force Change as a Measure for Current Carrying Capability

Abstract:

Determination of the current carrying capacity of contact springs is usually performed by measuring the temperature increase. The upper temperature limit is set by the temperature stability of the spring and the insulation material, the current limit is set accordingly.

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PCB Pad Ware Analysis at 0.4 mm Pitch – the story continues….

Abstract:

The intent of this presentation is to follow-up on the PCB Pad Wear presentation from BiTS 2010. Last year’s presentation focused on the mechanical interaction of various probe tip geometries of socket contacts in 0.8 mm pitch, offset PCB pads. This presentation will expand the study to the realm of the fine pitch by studying 0.4 mm pitch pads, with typical via-in-pad construction.

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