3D ICs – Smart, New Test Insertions make the difference

Abstract:

The additional risks in 3D packaging basically result from two facts:

1 . Stacking multiple dies into a 3D package also multiplies the probability of having a defective package in the end. In final test a package yield of 90 percent is realistic for standard packages. For a four-dies stacked package having 90 percent yield per die will bring down the overall yield to only 60 percent.

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Cost of MEMS Test

Abstract:

What used to be a technology driven by high-end automotive and medical applications has become a true commodity: MEMS. Any state of the art electronic gadget – be it a mobile phone, a tablet or a camera – makes extensive use of MEMS components.

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5G An Evolutionary Revolution Test

Abstract:

As we move to a new wireless paradigm, test methodologies are also starting to take shape. Today’s model for high volume manufacturing will change in the near future to meet the economies of scale for device production. High frequency signal handling, cost and device integration will drive high volume manufacturing test to new strategies. Industry conversations are also indicating that Multiple Input Multiple Output (MIMO) will continue to evolve as an effective technique for higher data rates.

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High Frequency PCB Material Characterization and Simulation

Abstract:

The presentation focused on the increasing operating frequency of many of today’s devices magnifies the importance of accurately characterizing the electrical performance of PCB materials used in test boards. Characterization not only ensures that the correct PCB materials are used for each application, but also that the performance is predictable.

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