Issue: There are numerous papers and articles about 3D packages; however, they have not been able to conquer the volume production status. One common issue is how to ensure quality across the overall and more complex supply chain.
For assembly this means that stacking dies bears a much higher risk for failure than single die technologies. Bad parts in the stack will corrupt good ones. The worst scenario adds a cost-intensive component such as a memory on a stack, which is dysfunctional. The KGD concept can only partly solve this.