Final Test Solution of WLCSP Devices

Abstract:

Wafer Level Chip Scale Package (WLCSP) technology is used because it produces low cost, small footprint packages to be directly mounted into smartphones, tablet PC’s and other mobile devices, as well as, automotive applications. The manufacture of these mobile devices and automotive applications are demanding lower defect parts per million (DPPM) from their suppliers of WLCSP devices.

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Poster “Final Test Solution of WLCSP Devices”

Abstract:

Wafer Level Chip Scale Package (WLCSP) devices are used because it offer low cost, small footprint packages to be directly mounted into smartphones, tablet PC’s and other mobile devices. The manufacture of these mobile devices are demanding lower defect parts per million (DPPM) from their suppliers of WLCSP devices.

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Challenges faced in High Volume Production test of RF devices on ATE

Abstract:

High volume production test of RF Wireless devices is dominated today by devices which are utilized primarily in the Connectivity and Mobility markets. This invited paper addresses some of the challenges faced by the ATE equipment when testing some of these RF devices.

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