Today MEMS sensor test requirements are far more challenging than just a couple of years ago. MEMS markets such as mobility, automotive and medical are driving new requirements. While some of these requirements may be easily achieved in an engineering lab environment, they can be a major challenge for high volume manufacturing (HVM). Environmental combination sensors are seeing a strong growth due to its wide breath of potential applications in consumer and automotive applications. These environmental sensors have very stringent temperature requirements which can be challenging to achieve in HVM.