Contactors for Final Test of Wafer-Level Devices

Abstract:

The wafer level chip scale package (WLCSP) has emerged as one of the best device packaging solutions for the continuing trend towards smaller, thinner, lighter, and less power end products. Compared with face up wire bonding flip chip, WLCSPs provide the shortest possible leads, the lowest inductance, the highest frequencies, the best noise control, the highest density, and the greatest number of I/Os in the smallest device footprints with the lowest profile.

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