WLCSP Contacting Technologies for 0.2 mm Pitch and Below

Abstract:

Spring probes have now been widely adopted as an alternative to well-known probe card technologies in testing WLCSP packaging. Several studies have been presented on this topic at BiTS and other conferences, and will be summarized.

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Contactor Based Final Test at 77 GHz on a Multi-Channel Radar Transceiver Chipset

Abstract:

Radar based active safety systems are in the automotive market today, enabling key applications such as emergency braking, adaptive cruise control, blind-spot monitoring, and cross-traffic alert. The industry is heavily invested in removing the challenges of integrating these functional applications into a cohesive system that will enable Autonomous Driving. Adoption is increasing with research estimating the market to grow to more than 50 million radar sensors in 20211, a 23 percent year-on-year increase from today.

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Poster “Atlas – The latest WLCSP Probe”

Abstract:

Xcerra is continuously improving the spring probes it manufactures for Wafer-Level test. This presentation describes an improvement that extends the life of a WLCSP probe that is used in a harsh environment.

In 2015 Xcerra introduced spring probe technology capable of contacting WLCSP devices down to 0.3 mm pitch. Probeheads employing this technology shipped to multiple sites. The technology performs well, providing excellent yields and long life.

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