5G Market Trend and Testing Challenges

Abstract:

As we carve into a new wireless paradigm, test methodologies are sharpening up also. The model for high volume manufacturing known today will change in the near future to meet the economies of scale for device production. High frequency signal handling, cost and device integration will drive high volume manufacturing test to new strategies. Fifth Generation (5G) cellular signals, having smaller wavelengths, create opportunity for device manufacturer’s to assemble wireless semiconductors with antennas into very small package size.

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Fan-In WLCSP Test Strategy

Abstract:

Wafer Level Chip Scale Package (WLCSP) devices are used because they offer very low cost, small footprint packages to be directly mounted into smartphones, tablets, other mobile devices and automotive applications. The type of technologies targeted for fan-in WLCSP packaging includes PMICs, transceivers, microcontrollers, IoT applications, MEMS and more.

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