Poster – Co-Axial Contacting

Abstract:

As device operating frequencies increase, the demand for reliable, production-worthy, high-frequency contactors is also increasing. High bandwidth has historically been the standard by which frequency performance is measured, and has typically been achieved by making the path through the contactor as short as possible, keeping it to a fraction of the shortest wavelength.

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Qualifying the Next Generation of WLCSP Contacting Technologies

This paper works to create a level playing field for interpreting, communication, and apply the electrical and mechanical specifications that describe test probe performance. Presented will be lab data describing the performance of Wafer Level Chip Scale Package (WLCSP) contacting technology.

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Next Generation WLCSP Contacting Technologies for 250 Micron Pitch and Below

Spring probes are becoming a viable alternative to traditional probe card technologies in testing WLCSP devices.

Manufacturing spring probes at this scale is very challenging, and various suppliers have taken different approaches to building them. This presentation will explore the various probe architectures that are commercially available, and present detailed mechanical and electrical lab performance of each style. Each contact technology will be presented from a mechanical and electrical reliability standpoint, as well as cost and complexity.

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Flat Probe Technology for RF Test

Abstract:

Today the semiconductor test market is very competitive. This is especially true in the consumable contactor market.

Low operating costs and low average selling prices create low barriers to entry. Micro-organizations plant themselves next to their sole customer and provide fast turn times at competitive prices and onsite support. Although this is acceptable for some it is a risky business model. Furthermore the depth of knowledge of the product and therefore the value add from these micro-organizations is limited.

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Poster – Contacting Challenges for 5G

Abstract:

There are numerous challenges to contacting 5G devices for test. These challenges are driven by devices becoming available before the standards are ratified, evolving test methods and tester resources, trends toward devices with antenna in package (AiP), and the range of test frequencies over the cmWave bands (3 GHz to 30 GHz) and mmWave brands (30 GHz to 100 GHz). Contacting solutions for these challenges require special considerations for the full path between the DUT and tester resource rather than limiting the focus to the interconnect between DUT and PCB.

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RF Characterization of Contactors for New High Frequency Markets

Abstract:

For new markets like 5G, Satellite internet, and automotive radar, contactor RF characterization has become more critical. Physical features in the contactor design can drastically change the RF performance. Beyond contactor design, the semiconductor device must be considered as it also has a major impact on RF performance. For instance, the device pinout and signaling type can result in drastically different performance even when using the same contacting technology. This paper will describe the RF parameters critical to defining contactor performance for new 5G, mmWave, automotive radar, WiGig and other high frequency applications. The tools necessary to measure and simulate these critical parameters will be described and finally the critical parameters will then be used to compare RF performance across various pinouts and contacting technologies.

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