WLCSP xWave for high frequency wafer probe applications

Today cmWave (3-30GHz) and mmWave (30-300GHz) applications have become mainstream. Packaging has become obsolete and wafers are becoming the new final test package. Testing automotive radar on wafer at 80 GHz and 150 degC was previously a fantasy, but is now a reality. With high power simulation tools and 110 GHz VNA’s it’s possible to design and fabricate hardware for these extremely high frequency, high temperature applications.

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Data Driven Comparison and Qualification of WLCSP Probes

Test probe selection decisions must be supported with verifiable and repeatable performance data. This include the lab data describing the statistically predicted field performance of the test probe. Presented will be lab data describing the performance of several mainstream probe architectures for contacting Wafer Level Chip Scale Packages (WLCSP). The goal of this paper is to create a common understanding of how to read, interpret, and communicate data for selecting the right probe technology for WLCSP test applications.

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