As we follow the Long Term Evolution (LTE) roadmap to 5G, we know for certain that 5G will be faster than 4G. Increasing speed with a need to reduce cost is motivating cell phone makers to use Antenna in Package (AiP) ICs. The result is increased development and deployment of AiP. AiP is the integration of all the complex RF components in one IC package with the baseband circuitry. This makes for a complete and self-contained module at the IC package level that significantly reduces the work of the system integrator.
This presentation describes and defines the data used to specify contactors and test sockets, and probe heads for test. The source methodology and process for developing the lab data describing these performance specifications is reviewed. In addition, the interpretation of data describing the performance of Over-the-Air contactors via antenna gain, bandwidth, and radiation pattern is covered along with statistically predicting field performance of the test probe versus performance measured in a test lab.