Cohu, the market leader for semiconductor test interfaces, provides innovative, reliable and cost-efficient solutions for all state-of-the-art applications like RF, precision analog, high end digital, mobility, and analog power. Cohu’s Interface Solutions Group is a one-stop partner, understanding the entire test cell.
Do not miss our expert presentations:
Solution for mmWave Wafer Probe Applications and Field Results
Date: Monday, March 4
Time: 10:30 a.m.
Speaker: Jason Mroczkowski, Director, RF Product Development and Marketing
Session 1A: High Frequency (HF), 5G, and millimeter-wave (mm-wave)
Abstract: Today cmWave (3-30 GHz) and mmWave (30-300 GHz) applications have become mainstream. The wafer is becoming the new final test package. Testing automotive radar on wafer at 80 GHz and 150 °C was previously a fantasy, but is now a reality. With high tech electromagnetic simulation tools and 110 GHz VNA’s it’s possible to design and fabricate hardware for these extremely high frequency, extreme temperature applications. Click here to read the full abstract
Spring Probe WLCSP Probe Head CCC – ISMI Characterization Is Not Enough
Date: Tuesday, March 5
Time: 1:30 p.m.
Speaker: Valts Treibergs, Research & Development Engineering Manager
Session 6A: Contact Technology
Abstract: A recognized standard for evaluating the CCC (current carrying capacity) of an interconnect used at wafer probe has been the ISMI Probe Council Current Carrying Capability Measurement Guideline, published by International SEMATECH Manufacturing Initiative in 2009. The ISMI test is a relatively simple way to observe the interconnect force degradation as a function of current applied. The guideline evaluates at what point the contact sees a 20% force reduction. This 20% force reduction, means that the contact has been permanently deformed, and this is therefore a truly destructive test. Click here to read the full abstract
Closer Tolerance Thermal Management at the Device-Under-Test
Date: Wednesday, March 6
Time: 10:00 a.m.
Speaker: Bert Brost, Senior Product Manager
Session 8: Thermal Management
Abstract: Effective thermal management has become mandatory for testing devices with faster switching speed transistors that are increasing in numbers in smaller packages. These devices are dissipating more heat while being held at steady test temperature extremes. In most cases, the heat will exit the device-under-test by conduction through the probes in the contactor. Newer probe technologies incorporate in-probe radiation features to support convection for thermal management along with two-point contact for effective conduction heat removal.
Click here to read the full abstract