Advanced Package Test Solution for Automotive Market

Abstract:

Consumer demand and competitive pressure have pushed automotive manufacturers to build greater intelligence into automobiles and trucks. For example, the Chevy Volt uses nearly 100 microprocessors running about 10 million lines of code in total, placing the Chevy Volt’s software content close to that of the Boeing 797 Dreamliner. As with that electrical vehicle, mainstream automotive design is increasingly relying on more sophisticated electronic systems.

Indeed, advances in automotive technology revolve around five key trend:

  • Advanced Driver Assistance System (ADAS) and Autonomous Driving
  • Advanced Motor Control
  • Engine/Energy Management Systems
  • Graphical Interfaces and Entertainment
  • Vehicle System of Systems in the Internet of Things

These growing trends require new advanced packages which had not been used to such an extent in harsh automotive environment in the past, e.g. combination of dedicated vision processors, multicore CPUs and vision software. For motor control new MCU and FPGA Solutions, for IoT, new combo MEMS, 5G for wireless external connectivity and extended bus systems for internal subsystems links.

Most of these developments were possible by integrating more and more functionality into one package and maintaining the stringent automotive safety and reliability requirements.

New backend test and handling systems had to be developed to address the new package requirements to ensure robust functionality.

This breakthrough technology provides:

  • The Lowest CoT for High Volume Manufacturing
  • Tri-temp for WLP, Fan-out and Other Small and Mid-size Packages Including Vision Inspection
  • Stimuli for Combo MEMS
  • Fine Pitch Kelvin Contacting

Version: November 2018
Presented by: Alex Waldauf
Presented at: SEMICON Europa