Inspection Module for enhanced micro-crack and sub-surface defect detection on wafer-level chipscale package (WLCSPs).
Cohu’s Aquilae vision module offers a breakthrough by integrating infrared imaging onto a high-speed automation platform that delivers an economical solution for high quality inspection.
The continuous increase of product quality requirements in IoT, mobility and automotive markets are driving the need for upstream detection of silicon defects on integrated circuits, which are not otherwise identifiable via electrical test. This is a growing segment in semiconductor inspection with increasing volume of WLCSPs and advanced packaging.
Infrared imaging has the ability to see through silicon, inspecting the structure underneath the surface that is not otherwise observable with traditional vision inspection systems. Cohu’s vision module offers a breakthrough by integrating infrared imaging onto a high-speed automation platform that delivers an economical solution for high quality inspection. The infrared vision module, in combination with previously announced Aquilae inspection and 3D Flex metrology, further strengthens Cohu’s differentiation in the growing semiconductor inspection market.
For more information on our Aquilae infrared vision module, please contact us email@example.com.