ECT’s battery probes are specifically designed for the OEM markets. Everett Charles Technologies’ versatile line of battery interconnect spring probes provides design flexibility to meet your performance, cost, and assembly requirements. ECT battery probes are used in a wide range of applications including docking stations, data transmission, PCB interposers, and contacts for connector assemblies for medical, mil/aero, transportation and more.
About Daniela Klostermeier
This author has yet to write their bio.Meanwhile lets just say that we are proud Daniela Klostermeier contributed a whooping 106 entries.
Entries by Daniela Klostermeier
Today cmWave (3-30 GHz) and mmWave (30-300 GHz) applications have become mainstream. The wafer is becoming the new final test package. Testing automotive radar on wafer at 80 GHz and 150 degC was previously a fantasy, but is now a reality
A recognized standard for evaluating the CCC (current carrying capacity) of an interconnect used at wafer probe has been the ISMI Probe Council Current Carrying Capability Measurement Guideline, published by International SEMATECH Manufacturing Initiative in 2009.
Effective thermal management has become mandatory for testing devices with faster switching speed transistors that are increasing in numbers in smaller packages. These devices are dissipating more heat while being held at steady test temperature extremes.
New Diamondx VI1x Instrument Enables High Multi-site Automotive and Industrial Device Testing. Automotive power electronics IC’s are complex and have stringent test requirements. Typically this limits how many IC’s can be tested in parallel, and thus inhibits the cost-effectiveness of modern highly parallel manufacturing test strategies.
High Bandwidth Memory (HBM) is a new type of memory device bringing higher bandwidth, smaller form factor and lower power consumption to keep up with processor performance growth. This is achieved by stacking multiple DRAM dies onto a base controller die, which are interconnected by through-silicon vias (TSV) and micro bumps.
A reliable and cost-effective method of interconnect between instrumentation and device under test Everett Charles Technologies (ECT) is proud to announce the addition of VG mass interconnect products to its already impressive catalog. VG mass interconnect is a series of modular test system interface products that allow quick connection of a DUT (device under test) […]
Leading test solutions for bare boards atg Luther & Maelzer to exhibit its innovative A8a Automatic Bare Board Flying Probe Test System at IPC APEX EXPO 2019, which is scheduled to take place on January 29 – 31, 2019, at the Convention Center in San Diego, CA.
Cohu’s intelligent cDragon Contactor ideally supports final testing at temperature and speed Cohu’s new cDragon combines advanced test features at temperatures from -55 °C to +155 °C with best RF capabilities and an innovative pin design for highest test yield and low cost of ownership. The closed-loop Intelligent Contactor Option controls the required conditions for the […]
In the last twelve months Everett Charles Technologies (ECT) substantially enhanced its product portfolio by releasing new products for RF test and board marking and by adding the VG product line from the Fixture Test Group. ECT also joined the GrabCAD community to facilitate access to ECT product drawings.