Entries by Daniela Klostermeier

WLCSP xWave for high frequency wafer probe applications

Today cmWave (3-30GHz) and mmWave (30-300GHz) applications have become mainstream. Packaging has become obsolete and wafers are becoming the new final test package. Testing automotive radar on wafer at 80 GHz and 150 degC was previously a fantasy, but is now a reality. With high power simulation tools and 110 GHz VNA’s it’s possible to design and fabricate hardware for these extremely high frequency, high temperature applications.

Data Driven Comparison and Qualification of WLCSP Probes

Test probe selection decisions must be supported with verifiable and repeatable performance data. This include the lab data describing the statistically predicted field performance of the test probe. Presented will be lab data describing the performance of several mainstream probe architectures for contacting Wafer Level Chip Scale Packages (WLCSP). 

Poster – Co-Axial Contacting

As device operating frequencies increase, the demand for reliable, production-worthy, high-frequency contactors is also increasing. High bandwidth has historically been the standard by which frequency performance is measured, and has typically been achieved by making the path through the contactor as short as possible, keeping it to a fraction of the shortest wavelength.

Poster – Contacting Challenges for 5G

There are numerous challenges to contacting 5G devices for test. These challenges are driven by devices becoming available before the standards are ratified, evolving test methods and tester resources, trends toward devices with antenna in package (AiP), and the range of test frequencies over the cmWave bands (3 GHz to 30 GHz) and mmWave brands (30 GHz to 100 GHz).

5G Market Trend and Testing Challenges

As we carve into a new wireless paradigm, test methodologies are sharpening up also. The model for high volume manufacturing known today will change in the near future to meet the economies of scale for device production. High frequency signal handling, cost and device integration will drive high volume manufacturing test to new strategies.