This presentation/paper will take you on a journey of testing cmwave/mmWave devices in High Volume semiconductor Manufacturing (HVM). Many believe that testing high frequency devices with contacted test will be too expensive.
About Daniela Klostermeier
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Entries by Daniela Klostermeier
This poster will walk through test cell challenges of testing 5G devices with integrated antennae and explore some unique solutions for performing this testing in production. The 5G Antenna in Package (AiP) devices require OTA test solutions at the lab and/or production level depending on Cost of Test (CoT) budget and correlation.
Today cmWave (3-30GHz) and mmWave (30-300GHz) applications have become mainstream. Packaging has become obsolete and wafers are becoming the new final test package. Testing automotive radar on wafer at 80 GHz and 150 degC was previously a fantasy, but is now a reality. With high power simulation tools and 110 GHz VNA’s it’s possible to design and fabricate hardware for these extremely high frequency, high temperature applications.
Test probe selection decisions must be supported with verifiable and repeatable performance data. This include the lab data describing the statistically predicted field performance of the test probe. Presented will be lab data describing the performance of several mainstream probe architectures for contacting Wafer Level Chip Scale Packages (WLCSP).
Gas sensors are being implemented into our everyday lives, on our handheld devices, wearables, and our homes, and all will be interconnected. There is a forecast CAGR of 6% until 2023 which will see the gas sensor industry reaching 1.3B US$ a year.
As device operating frequencies increase, the demand for reliable, production-worthy, high-frequency contactors is also increasing. High bandwidth has historically been the standard by which frequency performance is measured, and has typically been achieved by making the path through the contactor as short as possible, keeping it to a fraction of the shortest wavelength.
This paper works to create a level playing field for interpreting, communicating, and apply the electrical and mechanical specifications that describe test probe performance. Presented will be lab data describing the performance of Wafer Level Chip Scale Packages (WLCSP) contacting technology.
Spring probes are becoming a viable alternative to traditional probe card technologies in testing WLCSP devices. Manufacturing spring probes at this scale is very challenging, and various suppliers have taken different approaches to building them.
Today the semiconductor test market is very competitive. This is especially true in the consumable contactor market. Low operating costs and low average selling prices create low barriers to entry.
There are numerous challenges to contacting 5G devices for test. These challenges are driven by devices becoming available before the standards are ratified, evolving test methods and tester resources, trends toward devices with antenna in package (AiP), and the range of test frequencies over the cmWave bands (3 GHz to 30 GHz) and mmWave brands (30 GHz to 100 GHz).