Solution for mmWave Wafer Probe Applications and Field Results

Today cmWave (3-30 GHz) and mmWave (30-300 GHz) applications have become mainstream. The wafer is becoming the new final test package. Testing automotive radar on wafer at 80 GHz and 150 °C was previously a fantasy, but is now a reality. With high tech electromagnetic simulation tools and 110 GHz VNA’s it’s possible to design and fabricate hardware for these extremely high frequency, extreme temperature applications.

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Spring Probe WLCSP Probe Head CCC – ISMI Characterization Is Not Enough

A recognized standard for evaluating the CCC (current carrying capacity) of an interconnect used at wafer probe has been the ISMI Probe Council Current Carrying Capability Measurement Guideline, published by International SEMATECH Manufacturing Initiative in 2009. The ISMI test is a relatively simple way to observe the interconnect force degradation as a function of current applied. The guideline evaluates at what point the contact sees a 20% force reduction. This 20% force reduction, means that the contact has been permanently deformed, and this is therefore a truly destructive test.

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Closer Tolerance Thermal Management at the Device-Under-Test

Effective thermal management has become mandatory for testing devices with faster switching speed transistors that are increasing in numbers in smaller packages. These devices are dissipating more heat while being held at steady test temperature extremes. In most cases, the heat will exit the device-under-test by conduction through the probes in the contactor. Newer probe technologies incorporate in-probe radiation features to support convection for thermal management along with two-point contact for effective conduction heat removal.

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A New Singulated HBM Testing Solution – Breakthrough from Traditional ATE Test Method

High Bandwidth Memory (HBM) is a new type of memory device bringing higher bandwidth, smaller form factor and lower power consumption to keep up with processor performance growth. This is achieved by stacking multiple DRAM dies onto a base controller die, which are interconnected by through-silicon vias (TSV) and micro bumps. The advanced wafer level packaging to fabricate HBM chips also introduce increasing challenges in testing and handling of these delicate devices.

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Test Cell Innovation for Improved RF and MEMS Test Performance

Abstract:

The latest semiconductor applications continue to present test challenges which require innovative solutions to reach the required level of technical performance whilst delivering low cost of test and decreasing the time to develop and deploy test in production.

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Measurement Challenges for Over-the-Air Test of Antenna in Package (AiP) ICs

Abstract:

Over-the-Air (OTA) measurements are defined as standardized methods to evaluate performance of wireless semiconductors / transceivers / systems. In this paper, we will focus upon in-tester OTA measurement challenges in the upcoming fifth generation (5G) semiconductor designs which support the backbone of these wireless systems.

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Advanced Package Test Solution for Automotive Market

Abstract:

Consumer demand and competitive pressure have pushed automotive manufacturers to build greater intelligence into automobiles and trucks. For example, the Chevy Volt uses nearly 100 microprocessors running about 10 million lines of code in total, placing the Chevy Volt’s software content close to that of the Boeing 797 Dreamliner. As with that electrical vehicle, mainstream automotive design is increasingly relying on more sophisticated electronic systems.

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Data-Driven Comparison and Qualification of Test Contactors and Probes

Decision should be supported with verifiable and repeatable performance data. This is true when selecting contactors, test sockets, and probe heads for test. This intent of this paper is to describe and define the data used to specify contactors, test sockets, and probe heads for test. This includes the source methodology and process for developing the lab data describing the performance of contactors, test sockets, and probe heads for test. With this the paper will lead the way to interpret and apply the statistically predicted field performance of the test probe as qualified in a test lab.

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Over-the-Air Test for Antenna in Package IC

As we follow the Long Term Evolution (LTE) roadmap to 5G, we know for certain that 5G will be faster than 4G. Increasing speed with a need to reduce cost is motivating cell phone makers to use Antenna in Package (AiP) ICs. The result is increased development and deployment of AiP. AiP is the integration of all the complex RF components in one IC package with the baseband circuitry. This makes for a complete and self-contained module at the IC package level that significantly reduces the work of the system integrator.

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Interpretation and Application of Test Contactor Specification

This presentation describes and defines the data used to specify contactors and test sockets, and probe heads for test. The source methodology and process for developing the lab data describing these performance specifications is reviewed. In addition, the interpretation of data describing the performance of Over-the-Air contactors via antenna gain, bandwidth, and radiation pattern is covered along with statistically predicting field performance of the test probe versus performance measured in a test lab.

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