Decision should be supported with verifiable and repeatable performance data. This is true when selecting contactors, test sockets, and probe heads for test. This intent of this paper is to describe and define the data used to specify contactors, test sockets, and probe heads for test. This includes the source methodology and process for developing the lab data describing the performance of contactors, test sockets, and probe heads for test. With this the paper will lead the way to interpret and apply the statistically predicted field performance of the test probe as qualified in a test lab.
Presented will be lab data describing the performance of several mainstream probe architectures for contacting Wafer Level Chip Scale Packages (WLCSP). The goal of this paper is to create a common understanding of how to read, interpret, and communicate data for selecting the right probe technology for WLCSP test applications.
This paper goes beyond the probes and speaks to other factors that contribute to the overall performance of the contactors, test sockets, and probe heads for test. For example, the probe head housing design and materials used are important aspects that need to be understood for optimized performance. The success of the data-driven probe selection approach is reliant upon the quality of the supplier data. The paper will describe the reports provided including WLCSP Metrology reports.
- Interconnect technologies for improved performance and reliability
- The role of material, and material development for higher reliability
- Metrology and inspection methods
Version: November 2018
Presented by: Bert Brost
Presented at: SEMICON Europa