Flat Probe Technology for RF Test

Abstract:

Today the semiconductor test market is very competitive. This is especially true in the consumable contactor market.

Low operating costs and low average selling prices create low barriers to entry. Micro-organizations plant themselves next to their sole customer and provide fast turn times at competitive prices and onsite support. Although this is acceptable for some it is a risky business model. Furthermore the depth of knowledge of the product and therefore the value add from these micro-organizations is limited.

Outsourcing components can diminish the value add of the end product and lead to finger pointing and delivery delays. These factors push organization toward more stable and established vendors that can not only provide fast turn times and good support but they can focus on R&D and new product development. The ability of these organizations to fund R&D has resulted in revolutionary “flat probe” technologies that combine both electrical and mechanical performance at a significantly lower cost point than traditional radial spring probe technologies.

Larger spring diameters allow more force with less spring length allowing shorter and narrower probes than possible with radial technology. Furthermore the external plunger surfaces allow superior plating than in the internal surfaces of a barrel. Hard base materials offer longer life with lower contact resistance. Finally, with proper attention to the “guts” of the probe design, flat probe technologies can be used for high frequency semiconductor test applications. This presentation will introduce various flat probe technologies and compare and contrast their designs against other flat probe technologies as well as against radial probe technologies.

Version: March 2018
Presented by: James Hattis
Presented at: SEMiSRAEL

Version: September 2017
Presented by: Dong Mei Han
Presented at: BiTS China

Version: March 2017
Presented by: Jason Mroczkowski
Presented at: BiTS