New Strategies for Functional Test of Multiple MEMS Sensor Types Within One Package

Abstract:

While MEMS manufacturing is becoming more and more mature even at 8″ wafer technology, for most suppliers, the integration of various MEMS sensor applications within one package in creating a bottle neck at final MEMS test and calibration. Due to the unique stimulus requirements for the sensors the stimulus architecture often does not allow them to easily be combined into one and the same test handling machine.

Additionally, the temperature sensitivity of the MEMS modules is significantly increasing. Other trends such as constant package size reduction and increasing specification requirements are negatively influencing the test costs as well. The initial investment into final test equipment could become a barrier especially for smaller companies and startups.

Version: October 2011
Presented by: Andreas Nagy
Presented at: SEMICON Europa 2011