Measurement Challenges for Over-the-Air Test of Antenna in Package (AiP) ICs


Over-the-Air (OTA) measurements are defined as standardized methods to evaluate performance of wireless semiconductors / transceivers / systems. In this paper, we will focus upon in-tester OTA measurement challenges in the upcoming fifth generation (5G) semiconductor designs which support the backbone of these wireless systems.

There are key technologies that will be used in high volume production 5G OTA measurements, including the test contactor designs which support direct in-tester OTA characterization of these devices under test (DUT) which contain integrated antenna systems, coplanar waveguide (CPW) and micro-strip structures, waveguide to transmission line launches (and visa-versa), Anechoic chamber technology, as well as passive components to aid in signal manipulation in order to make characterization of the DUT easier.

There are definite design challenges for these OTA contactors in order to maintain the high levels of signal integrity required to maintain accurate OTA measurements at 5G centimeter (cm) and millimeter (mm) wave frequencies. High volume production of OTA semiconductors also requires the test contactor to have both mechanical ruggedness and precise electrical simulation and modeling which feedback into the mechanical design to assure high frequency performance necessary for accurate characterization of the DUT.

Version: November 2018
Presented by: James Hattis
Presented at: SemIsrael Expo