Poster “Final Test Solution of WLCSP Devices”

Abstract:

Wafer Level Chip Scale Package (WLCSP) devices are used because it offer low cost, small footprint packages to be directly mounted into smartphones, tablet PC’s and other mobile devices. The manufacture of these mobile devices are demanding lower defect parts per million (DPPM) from their suppliers of WLCSP devices.

Suppliers require a final test solution to meet their customer’s demands.
Version: October 2015
Presented by: Mike Frazier
Presented at: ITC Test Week