Today cmWave (3-30 GHz) and mmWave (30-300 GHz) applications have become mainstream. The wafer is becoming the new final test package. Testing automotive radar on wafer at 80 GHz and 150 °C was previously a fantasy, but is now a reality. With high tech electromagnetic simulation tools and 110 GHz VNA’s it’s possible to design and fabricate hardware for these extremely high frequency, extreme temperature applications.
This paper will introduce a unique and robust high volume semiconductor test solution designed for wafers in the cmWave and mmWave frequency bands. This new WLCSP probe card technology incorporates the shortest impedance controlled path from the Tester to the Device Under Test (DUT) by eliminating the PCB interface and contacting directly with the DUT. The cantilevered leadframe technology carries the mmWave signals directly from the tester to the DUT. The Hybrid contactor leverages traditional spring probes for power and low speed signals transmission. Combining technologies provides the longest life, most robust solution available for high speed wafer testing.
An introduction to the cmWave and mmWave markets will be followed by the challenges that had to be overcome to take this technology from final test applications to wafer test. Optimization of the signal path for the best signal integrity and mechanical characteristics will be described. The full assembly will be broken down to describe functionality and field maintainability. Finally customer test data will be presented to prove the technology functions as expected in extreme frequency and temperature high volume semiconductor environments.
Version: March 2019
Presented by: Jason Mroczkowski
Presented at: TestConX