October 18 to 19, Sheraton Hsinchu Hotel, Zhubei City, Taiwan
5G Universal Test Interconnect Solutions for Advanced Testing at the Wafer and Die Level
Learn more about the most comprehensive semiconductor test probe portfolio at the Xcerra booth #205
Xcerra has unique interface technologies that enable advanced testing of 5G devices at the wafer and die level with the same high bandwidth low noise probe technology. Xcerra xWave technology allows placement of patch antennas in probe heads or contactors for Over-the-Air (OTA) 5G testing at the die, package, or module level. Using the same probe technology for wafer and package test reduce costs, reduces time to market, and improves overall consistency with 100% correlation between lab and production test.
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