Posts

Closer Tolerance Thermal Management at the Device-Under-Test

Effective thermal management has become mandatory for testing devices with faster switching speed transistors that are increasing in numbers in smaller packages. These devices are dissipating more heat while being held at steady test temperature extremes. In most cases, the heat will exit the device-under-test by conduction through the probes in the contactor. Newer probe technologies incorporate in-probe radiation features to support convection for thermal management along with two-point contact for effective conduction heat removal.

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Data-Driven Comparison and Qualification of Test Contactors and Probes

Decision should be supported with verifiable and repeatable performance data. This is true when selecting contactors, test sockets, and probe heads for test. This intent of this paper is to describe and define the data used to specify contactors, test sockets, and probe heads for test. This includes the source methodology and process for developing the lab data describing the performance of contactors, test sockets, and probe heads for test. With this the paper will lead the way to interpret and apply the statistically predicted field performance of the test probe as qualified in a test lab.

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Interpretation and Application of Test Contactor Specification

This presentation describes and defines the data used to specify contactors and test sockets, and probe heads for test. The source methodology and process for developing the lab data describing these performance specifications is reviewed. In addition, the interpretation of data describing the performance of Over-the-Air contactors via antenna gain, bandwidth, and radiation pattern is covered along with statistically predicting field performance of the test probe versus performance measured in a test lab.

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Changes in Markets, Technologies and Manufacturing flows driving disruptions in Test deployment

Abstract:

  • What will drive the direction of semiconductor testing over the next 3-5 years (Markets, technologies, manufacturing)
  • What does this mean for semiconductor test
  • How can/will the test industry respond

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Using Distributed Test on ATE to increase throughput and lower COT at final test

Abstract:

Analog and low pin count device test cells may often use ‘turret’ style handlers, in which each stage can be configured to do a specific back-end process task in a serial manner.

Due to this serial, single flow “production line” design, a turret handler approach adds inefficiencies. The whole process only goes as fast as the slowest stage. The overall UPH decreases significantly as test time increases. The classical multisite test is non-ideal and adds a significant overhead to the process flow.

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Explaining Overall Equipment Effectiveness (OEE) and How It Can Help You Maximize the Efficiency of Your Test Cell

Abstract:

Overall Equipment Effectiveness (OEE) aligns the activities of production test to critical measures for helping customers run their test floors like finely-tuned machines. These measures are linked to delivering quality devices efficiently and cost effectively.

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Exploring Semiconductor Test Equipment Business Cycles

Abstract:

This article is intended to explore what drives semiconductor test equipment sales cycles. Are the cycles of the past gone forever? Are we in a period where seasonality rules the day? Are there any opportunities for sustained growth? What should companies be doing in this “new normal”?

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Specmanship

Abstract:

Specmanship is the art of improving the appearance of technical specifications which, once improved, may no longer reflect reality. For example:

RF Specifications:

Bandwidth is often stated without supplying critical information such as pitch, ground configuration, and dielectric, and is of course reported under ideal conditions.

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