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Final Test Solution of WLCSP Devices

Abstract:

Wafer Level Chip Scale Package (WLCSP) devices are used because they offer low cost, small footprint packages to be directly mounted into smartphones, tablet PC‘s and other mobile devices and meanwhile even in automotive applications. The manufactures of these mobile and automotive application devices are demanding lower defect parts per million (DPPM) from their suppliers of WLCSP devices.

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Kelvin Contactors for Wafer-Scale Test

Abstract:

The only way that these tests can be performed accurately and repeatably in a high-volume test environment, over hundreds of thousands of insertions, is to contact the device through a Kelvin connection.As more functionality is included in integrated circuits, there is an increasing need to make extremely accurate voltage measurements or force extremely accurate voltages to perform tests such as RDSON and VDO.

The challenge of wafer-scale test is performing final test, with its high currents, accurate measurement requirements and full-speed functional, at the wafer level. This requires a high-performance contact method that fits into the wafer-probe environment. If Kelvin contact is required, the challenge is dramatically increased.

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