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PCB Pad Ware Analysis at 0.4 mm Pitch – the story continues….

Abstract:

The intent of this presentation is to follow-up on the PCB Pad Wear presentation from BiTS 2010. Last year’s presentation focused on the mechanical interaction of various probe tip geometries of socket contacts in 0.8 mm pitch, offset PCB pads. This presentation will expand the study to the realm of the fine pitch by studying 0.4 mm pitch pads, with typical via-in-pad construction.

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