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Gas and Humidity Sensors Today and the Challenges of Accurately Testing in High Parallelism

Gas sensors are being implemented into our everyday lives, on our handheld devices, wearables, and our homes, and all will be interconnected. There is a forecast CAGR of 6% until 2023 which will see the gas sensor industry reaching 1.3B US$ a year. For the manufacturers CoT is a major factor, as, with the higher volumes, the ASP will continue to drop, following the other MEMS sensors trend.

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MEMS sensor testing challenges and requirements (article)

Abstract:

Andreas Bursian, Director InStrip & InMEMS Products, authored an article for Chip Scale Review Magazine, in which he elaborates on the question of what the test requirements for MEMS sensor devices will be in the future. Before he goes into detail, he describes in general what our world will look like in the future shaped by IoT and Industry 4.0., and how this will drive MEMS and sensor technology.

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Proposal for the sensor test process to succeed in IoT market

Abstract:

As application for IoT continue to expand in smart cities, home automation, connected vehicles, and health care, this has become a significant growth driver for semiconductor devices. Meeting the challenges of double digit growth in unit volumes, relentless cost pressure and the ability to address a variety of sensors are required to succeed in this technology. We introduce an advanced mass production test technique for various sensors.

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MEMS Sensor Testing Challenges and Requirements

Abstract:

Today MEMS sensor test requirements are far more challenging than just a couple of years ago. MEMS markets such as mobility, automotive and medical are driving new requirements. While some of these requirements may be easily achieved in an engineering lab environment, they can be a major challenge for high volume manufacturing (HVM). Environmental combination sensors are seeing a strong growth due to its wide breath of potential applications in consumer and automotive applications. These environmental sensors have very stringent temperature requirements which can be challenging to achieve in HVM.

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“Taking MEMS test and calibration to the next level ” – An integrated platform approach driving further MEMS growh

Abstract:

What used to be a technology driven by high-end automotive and medical applications has become a true commodity: MEMS. Any state of the art electronic gadget – be it a mobile phone, a tablet or a camera – makes extensive use of MEMS components.

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Minimizing Cost of Calibration and Test for MEMS devices

Abstract:

What used to be a technology driven by high-end automotive and medical applications has become a true commodity: MEMS. Any state of the art electronic gadget – be it a mobile phone, a tablet or a camera – makes extensive use of MEMS components.

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Cost of MEMS Test

Abstract:

What used to be a technology driven by high-end automotive and medical applications has become a true commodity: MEMS. Any state of the art electronic gadget – be it a mobile phone, a tablet or a camera – makes extensive use of MEMS components.

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Minimizing Cost of Calibration and Test (COCT) to drive cost reduction of MEMS

Abstract:

What used to be a technology driven by high-end automotive and medical applications has become a true commodity: MEMS. Any state of the art electronic gadget – be it a mobile phone, a tablet or a camera – makes extensive use of MEMS components.

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MEMS Fusion – Challenges in Final Test

Abstract:

Sensors and MEMS applications are drastically increasing. Almost any area of today’s lives uses their advantages. In general this has two implications:

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Enabling Highly Parallel Test SOCs, Sensors and 3D Packages

Abstract:

Testers are struggling to keep up with Moore’s Law by integrating more channels, power supplies, and analog resources per board.  DFT and adaptive test are driving shorter test times. Memory testers can currently test 256/512 devices in parallel, enabled by highly parallel handling capability. What is the future path of SOC/Sensor test?

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