New Strategies for Functional Test of Multiple MEMS Sensor Types Within One Package


While MEMS manufacturing is becoming more and more mature even at 8″ wafer technology, for most suppliers, the integration of various MEMS sensor applications within one package in creating a bottle neck at final MEMS test and calibration. Due to the unique stimulus requirements for the sensors the stimulus architecture often does not allow them to easily be combined into one and the same test handling machine.

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